ESP8266 ESP12F ESP-12F ESP12 ESP 12F Serial WiFi



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ESP8266 ESP12F ESP-12F ESP12 ESP 12F Serial WiFi


  • ESP-12F is encapsulated  by the high performance chip ESP8266EX. The chip is encapsulated a advanced Tensilica’s L106 32-bit MCU, with 16-bit short mode, basic frequency support 80 MHz, 160 MHz, supports RTOS. ESP8266EX has the full and complete WiFi fuction, which can used independently and alsoused as a slaver with other Hoster MCU, which can start directly from the out-built Flash. In addition, the built-in high-speed buffer is benefit for the system performance. Especially, ESP8266EX can be used as a WiFi adapter by SPI/SDIO and/or I2C/UART interface, when it is applied to the other MCU design.


SOC characteristics

  • Built-in Tensilica L106 ultra-low power 32-bit CPU, main frequency supports 80MHz and160MHz, and RTOS;

  • Built-in TCP/IP protocol;

  • Built-in one-channel 10-bit high precision ADC;

  • Outboard interface: HSPI, UART, I2C, I2S, IR Remote Controk, PWM, GPIO;

  • Deep sleep current is 10uA, the cut-off current is smaller than 5uA;

  • Wake,connect and transmission data package within 2ms;

  • The consume power is smaller 1.0Mw (DTIM3) when at stand by status;

  • Built in 1M byte for SPI Flash.

WiFi characteristics

  • Support 802.11 b/g/n/e/I;

  • Support Station, Soft AP, Soft AP+STA mode;

  • Support WiFi Direct (P2P);

  • Support CCMP (CBC-MAC, computation mode), TKIP (MIC, RC4), WAPI (SMS4), WEP (RC4), CRC etc., for hardware acceleration.

  • P2P finding, P2P GO mode/ GC mode and P2P power manage

  • WPA/PA2PSK and WPS;

  • 802.11 security certification: pre-certification and TSN

  • Support 802.11n (2.4GHz);

  • 802.1h/RFC1042 frame encapsulation;

  • Support seam less roaming;

  • Support AT remote update and cloud update (OTA);

  • Support Smart Config function (including Android and Ios device).

Module interface

  • 2* UART;

  • 1*ADC;

  • 1*En;

  • 1*wakeup pin;

  • 1*HSPI;

  • 1*I2C;

  • 1*I2S

  • More than 10*GPIOs

Working temperature: -40℃-+125℃;

Module size:


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